Solder Resistのメーカーや取扱い企業、製品情報、参考価格、ランキングをまとめています。
イプロスは、 製造業 BtoB における情報を集めた国内最大級の技術データベースサイトです。

Solder Resist - メーカー・企業4社の製品一覧とランキング

Solder Resistの製品一覧

1~4 件を表示 / 全 4 件

表示件数

What is solder resist that you can't ask about now?

Introducing the design and implementation perspective on "applying solder adhesion prevention to unnecessary areas"!

"Solder resist" is an insulating film approximately 30μm thick that is applied to the surface of printed circuit boards, and it is often simply referred to as "resist." The colors known are green, blue, red, yellow, black, and white. The prevalence of green is commonly attributed to the fact that patterns are more visible and easier on the eyes of inspectors. One of the purposes of applying this resist is to "prevent solder adhesion to unnecessary areas (to prevent solder from adhering to unintended places)," but this perspective is from the viewpoint of the applicator. In this blog, we introduce "solder resist" from the design and implementation perspective. *For more detailed content of the blog, you can view it through the related links. Please feel free to contact us for more information.

  • screenshot_04.png
  • paint

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Photosensitive coverlay for flexible circuit boards.

Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.

The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to greater design freedom, and eliminates the need for coverlay, enabling significant thinning and weight reduction of the entire substrate. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High flexibility that does not produce cracks even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly applied ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Resist Device

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Flame-retardant flexible substrate thermosetting solder resist

Flame-retardant flexible substrate thermosetting solder resist

This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free compliant ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via request for materials or download.

  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

[Column] What is the Role of Solder Resist? Introducing Its Importance, Types, and Characteristics

What is the role of solder resist? Introducing its importance, types, and characteristics! / Leave the design, development, and manufacturing of printed circuit boards to Nippo! /

Solder resist is an ink or film-like protective material applied to the surface of printed circuit boards (PCBs) that serves to protect the circuits on the substrate. During the soldering process, there is a risk of short circuits due to solder bridges, but the presence of solder resist prevents shorts between circuits, thereby enhancing the reliability of the product. It also effectively protects the substrate from moisture and chemicals, contributing to corrosion prevention. There are two types of solder resist: "liquid type" and "film type." < Liquid Type > This type involves applying ink-like material using screen printing or spraying, making it suitable for complex-shaped substrates. Many products contain components with high heat resistance and chemical resistance tailored to specific applications, characterized by flexibility during the assembly process. < Film Type > The film type involves adhering sheet-like resist to the substrate and curing it with UV light. It allows for uniform and high-precision application, making it suitable for fine patterns and high-density substrates. A benefit is that there are fewer processes using release agents, resulting in a clean finish. Nippo conducts the design, development, and manufacturing of printed circuit boards. Please feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録