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Solder Resist Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

Solder Resist Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. TAMURA CORPORATION Tokyo//Industrial Electrical Equipment
  2. ニッポー Saitama//Electronic Components and Semiconductors
  3. ケイ・オール Tokyo//Manufacturing and processing contract
  4. 4 アサヒ化学研究所 Tokyo//Chemical
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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Solder Resist Product ranking

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. Photosensitive coverlay for flexible circuit boards. TAMURA CORPORATION
  2. [Column] What is the Role of Solder Resist? Introducing Its Importance, Types, and Characteristics ニッポー
  3. What is solder resist that you can't ask about now? ケイ・オール
  4. 4 Flame-retardant flexible substrate thermosetting solder resist アサヒ化学研究所
  5. 5 Automotive Solder Resist Formation Technical Document プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所

Solder Resist Product List

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What is solder resist that you can't ask about now?

What is solder resist that you can't ask about now?

Introducing the design and implementation perspective on "applying solder adhesion prevention to unnecessary areas"!

"Solder resist" is an insulating film approximately 30μm thick that is applied to the surface of printed circuit boards, and it is often simply referred to as "resist." The colors known are green, blue, red, yellow, black, and white. The prevalence of green is commonly attributed to the fact that patterns are more visible and easier on the eyes of inspectors. One of the purposes of applying this resist is to "prevent solder adhesion to unnecessary areas (to prevent solder from adhering to unintended places)," but this perspective is from the viewpoint of the applicator. In this blog, we introduce "solder resist" from the design and implementation perspective. *For more detailed content of the blog, you can view it through the related links. Please feel free to contact us for more information.

  • screenshot_04.png
  • paint
  • Solder Resist

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Photosensitive coverlay for flexible circuit boards.

Photosensitive coverlay for flexible circuit boards.

Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.

The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to greater design freedom, and eliminates the need for coverlay, enabling significant thinning and weight reduction of the entire substrate. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High flexibility that does not produce cracks even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly applied ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Resist Device
  • Solder Resist

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Flame-retardant flexible substrate thermosetting solder resist

Flame-retardant flexible substrate thermosetting solder resist

Flame-retardant flexible substrate thermosetting solder resist

This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free compliant ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via request for materials or download.

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  • Solder Resist

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[Column] What is the Role of Solder Resist? Introducing Its Importance, Types, and Characteristics

[Column] What is the Role of Solder Resist? Introducing Its Importance, Types, and Characteristics

What is the role of solder resist? Introducing its importance, types, and characteristics! / Leave the design, development, and manufacturing of printed circuit boards to Nippo! /

Solder resist is an ink or film-like protective material applied to the surface of printed circuit boards (PCBs) that serves to protect the circuits on the substrate. During the soldering process, there is a risk of short circuits due to solder bridges, but the presence of solder resist prevents shorts between circuits, thereby enhancing the reliability of the product. It also effectively protects the substrate from moisture and chemicals, contributing to corrosion prevention. There are two types of solder resist: "liquid type" and "film type." < Liquid Type > This type involves applying ink-like material using screen printing or spraying, making it suitable for complex-shaped substrates. Many products contain components with high heat resistance and chemical resistance tailored to specific applications, characterized by flexibility during the assembly process. < Film Type > The film type involves adhering sheet-like resist to the substrate and curing it with UV light. It allows for uniform and high-precision application, making it suitable for fine patterns and high-density substrates. A benefit is that there are fewer processes using release agents, resulting in a clean finish. Nippo conducts the design, development, and manufacturing of printed circuit boards. Please feel free to contact us.

  • Printed Circuit Board
  • Solder Resist

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Automotive Solder Resist Formation Technical Document

Automotive Solder Resist Formation Technical Document

Specifications such as terminal size, clearance, and solder mask thickness are included!

In the automotive industry, the reliability of electronic substrates is extremely important. Products that can withstand harsh environments are required, and the proper selection and formation of solder resist are essential for maintaining the long-term performance of the products. Improper design or formation of solder resist can lead to failures caused by vibration and temperature changes. Our materials on solder resist formation technology contribute to improving the reliability of electronic substrates for automotive applications. 【Usage Scenarios】 - In-vehicle electronic devices - ECU (Electronic Control Unit) - Various sensors 【Effects of Implementation】 - Improved substrate quality - Increased product lifespan - Reduced risk of failure

  • Printed Circuit Board
  • Solder Resist

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Technical Documentation on Solder Resist Formation for Game Consoles

Technical Documentation on Solder Resist Formation for Game Consoles

Presented is a document summarizing the specifications for heat dissipation measures for game consoles!

In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become crucial. In particular, to handle high thermal density within limited space, the selection of appropriate solder resist is essential. Inappropriate solder resist can hinder heat conduction, potentially leading to decreased product performance or failure. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are useful for product selection. 【Application Scenarios】 - Circuit board design for high-performance gaming consoles - Selection of circuit boards requiring heat dissipation measures - Design of compact and high-density mounted circuit boards 【Benefits of Implementation】 - Improved heat dissipation through appropriate solder resist selection - Enhanced product reliability - Reduction in design workload

  • Printed Circuit Board
  • Solder Resist

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Technical Document on Solder Resist Formation Technology for Industrial Robots

Technical Document on Solder Resist Formation Technology for Industrial Robots

We are offering materials that will assist in the design of high-precision industrial robot circuit boards!

In the industrial robot industry, the reliability of the circuit board is crucial for achieving high-precision movements. Particularly in circuit boards related to positioning and control, the accuracy of the solder resist significantly impacts the robot's performance. Defects in the solder resist can lead to malfunctions or failures, potentially resulting in decreased production efficiency. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are helpful in product selection. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Robot hands performing delicate tasks - Industrial robots used in harsh environments 【Benefits of Implementation】 - Improved robot performance through optimized circuit board design - Reduced risk of failure by achieving reliable circuit boards - Shortened product selection time

  • Printed Circuit Board
  • Solder Resist

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Aerospace Solder Resist Formation Technical Document

Aerospace Solder Resist Formation Technical Document

We present materials that include specifications such as terminal size, clearance, and solder mask thickness!

In the aerospace industry, there is a constant demand for lightweight products. In the design of printed circuit boards, solder resist significantly impacts component mounting density and reliability, making proper selection crucial. The selection of solder resist contributes to product miniaturization and weight reduction. Our materials on solder resist formation technology can help address these challenges. 【Application Scenarios】 - Electronics for aircraft and spacecraft - Circuit board designs requiring weight reduction - High-density mounting circuit boards 【Benefits of Implementation】 - Optimization of circuit board design - Weight reduction of products - Improved reliability

  • Printed Circuit Board
  • Solder Resist

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Technical Document on Solder Resist Formation for Smartphones

Technical Document on Solder Resist Formation for Smartphones

We present materials that are helpful for high-density smartphone circuit board design!

In the smartphone industry, high-density mounting of printed circuit boards is required due to miniaturization and increased functionality. It is particularly important to enhance the component placement density within limited space and ensure the reliability of electrical connections. Proper design of solder resist is essential for solving these challenges. Our materials on solder resist formation technology support the optimization of design for high-density mounting. 【Usage Scenarios】 - Design of high-density mounting boards - Optimization of component placement - Improvement of electrical connection reliability 【Effects of Implementation】 - Increased efficiency in board design - Miniaturization and high performance of products - Improved yield

  • Printed Circuit Board
  • Solder Resist

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Technical Documentation for Solder Resist Formation for IoT Devices

Technical Documentation for Solder Resist Formation for IoT Devices

Specifications such as terminal size, clearance, and solder mask thickness are listed.

In the IoT device industry, high durability that can withstand harsh environments is required. Especially for devices exposed to temperature changes, vibrations, and humidity, the reliability of printed circuit boards is a crucial factor that influences product lifespan. The proper selection and formation of solder resist are essential to protect the substrate from these external factors and ensure the long-term operation of the device. Our materials on solder resist formation technology will be helpful when selecting products. 【Usage Scenarios】 - Outdoor IoT devices - Industrial IoT equipment - IoT devices used in harsh environments 【Benefits of Implementation】 - Improved substrate protection performance - Enhanced product reliability - Assurance of long-term product lifespan

  • Printed Circuit Board
  • Solder Resist

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Server-side solder resist formation technical documentation

Server-side solder resist formation technical documentation

Presentation of technical materials on solder resist technology that contributes to server acceleration.

In the server industry, there is a demand for improved data processing speeds and stability in signal transmission. Particularly, as high-density implementation progresses, the precision of solder resist becomes crucial. Inadequate solder resist can lead to signal interference and short circuits on the substrate, potentially resulting in a decline in server performance. Our materials on solder resist formation technology include specifications such as terminal size, clearance, and solder mask thickness, which are helpful in product selection. 【Usage Scenarios】 - Servers performing high-speed data communication - Servers using high-density implementation substrates - Servers where signal integrity is critical 【Benefits of Implementation】 - Stabilization of signal transmission - Improved reliability of the substrate - Reduction in product selection time

  • Printed Circuit Board
  • Solder Resist

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Technical Document on Solder Resist Formation for Communication Infrastructure

Technical Document on Solder Resist Formation for Communication Infrastructure

Specifications such as terminal size, clearance, and solder mask thickness are listed.

In the telecommunications infrastructure industry, particularly in the field of signal integrity, the reliability of printed circuit boards is crucial. To ensure accurate signal transmission, precision in component placement on the board is required. Proper design and formation of solder resist prevent short circuits and disconnections, contributing to the long-term stability of the product. Our materials on solder resist formation technology are helpful during product selection. 【Usage Scenarios】 - PCB design for communication devices - Protection of signal transmission paths - Shielding of high-frequency circuits 【Benefits of Implementation】 - Improved board reliability - Increased product lifespan - Stabilization of signal quality

  • Printed Circuit Board
  • Solder Resist

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